英特尔宣布，率先在产品级测试芯片上实现背面供电技术

发布日期：2023-07-03    点击次数：187

6月6日消息，英特尔宣布在业内率先在产品级测试芯片上实现背面供电（backside power delivery）技术，满足迈向下一个计算时代的性能需求。

作为英特尔业界领先的背面供电解决方案，PowerVia将于2024年上半年在Intel 20A制程节点上推出。通过将电源线移至晶圆背面，PowerVia解决了芯片单位面积微缩中日益严重的互连瓶颈问题。

英特尔领先业界为客户提供PowerVia背面供电技术，并将在未来继续推进相关创新，延续了其率先将半导体创新技术推向市场的悠久历史。

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